I-EAK wire bonding resistors (izimbangi eziboshiwe) ezinzile kakhulu, ezinokwethenjelwa okuphezulu.Ukunqunywa kwe-laser ekubekezeleleni okuqinile.Inani elenziwa ngendlela oyifisayo kanye nethokheni eyingqayizivele yalelo nani.Idivayisi ifaneleka kahle kodwa ayikhawulelwe kuzinhlelo zokusebenza zesekethe ye-hybrid.Iphakheji yokubopha nge-diode chip, chip MOS, chip IGBT.
Izinzuzo kanye nezici
Oxhumana nabo abaphezulu/ukuhlukaniswa okuphansi
ukuzinza okuphezulu kakhulu ukuthembeka okuphezulu
ukubekezelelana okuqinile kakhulu
ukukhangisa kwenani eliyingqayizivele
Amandla alinganiselwe angama-250mW
Izinhlelo zokusebenza ezijwayelekile
Ukufakelwa kwezokwelapha
ezempi/ukuzivikela
i-multi-chip module (MCM)
ithuluzi lokuhlola nelokulinganisa
ukuthembeka okuphezulu kwe-microelectronic
ukuxhumana kwamafrikhwensi omsakazo/ama-microwave
Isikhathi sokuthumela: Jun-04-2024